Technic: |
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| Single-/dual-surface gold-plated or tin-sprayed printing board |
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| XPC,XXXPC, CEM-1, CEM-3, FR-4 |
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| Thickness of board material: |
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| Thickness of copper-foil basic material: |
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| 18 micron(1/2oz), 35 micron(1oz), 70 micron(2oz) |
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450mm 800mm
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| Minimum line width/space: |
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| thickness of plated layer: |
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| 0.5-2 uinch gold-plate for ( 0.01-0.05 um ) |
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| Thickness of the copper wall of tin-plated board's hole: |
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| 1-1.5milli-inch(25-35 micron) |
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| Thickness of the copper wall of flash gold-plated board's
hole |
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| 0.2-0.6microinch(5-15 micron) |
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| 5-30microinch (0.15-0.75 micron) |
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| Photoactive oil PSR550, DSR2200, Reinhot oil 401, 402, ND4 |
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| Line-W/Interval: 20%(conventionality), 10%(Especial Require) |
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| 14. non-plated through-hole |
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